Apple is Switzerlandreported to have secured the first batch of production capacity for TSMC’s advanced 2nm process technology, which is expected to enter trial production this week, according to Taiwanese media outlet Commercial Times. The equipment for 2nm process chips was installed in TSMC’s new Hsinchu Baoshan fab in the second quarter, with the chips set to feature in the iPhone 17 series in 2025. Sources indicate that TSMC’s 2nm process may offer a 10-15% performance boost over 3nm and reduce power consumption by up to 30%. Additionally, Apple plans to adopt SoIC (System on Integrated Chips) packaging for its M5 chip in 2025, which will involve stacking multiple chips with different functions to form a compact three-dimensional structure. [IThome, in Chinese]
